CVC Products RF Sputterer

Trainers

The RF sputterer can be used to deposit many dielectrics. We have sputter targets for silicon dioxide, indium tin oxide, zinc oxide, silicon nitride and other materials.

RF sputterer coatings are performed by accelerating ions of argon or an argon oxygen mixture into the surface of a sputter target, which is made of the material to be applied to the sample. The gas ions cause atoms to be knocked off of the target and deposited on the sample being coated.

Features

• batch type production deposition system
• 8" silicon dioxide target for rapid sputtering
• two user changeable targets for sputtering of many different materials
• optional back side substrate heating for zinc oxide deposition.

Operating Characteristics

Typical Deposition Rates

Operating Limits

Operating Instructions

I. Loading the Sputterer

1. Login to the machine.
2. The machine will display the Pal System Option Page.  This page allows you to run batches (Operate), edit/view batches (Batch), and edit/view recipes (Recipe).  To choose any options while using the sputterer, scroll through the names of the options using the cursor keys (Note:  the left and right arrow keys scroll through the first row of options, and the up and down arrows display any additional rows of options).  Press enter to select an option.
3. Choose Operate.  The machine will display the last page viewed in Operate mode.  To go to another page choose Select and choose the name of the page you wish to view.  Go to the Logo Page.
4. The Logo Page displays the logo of CVC.  Choose Direct Control. Choose RUN.  Choose VENT.
5. Wait till the screen says "****Chamber Vented Hoist Enabled****".  Then press and hold the Hoist Up button located above the monitor.  The top of the chamber will rise.  Continue holding the Hoist Up button until you can look under the top of the chamber and see the targets.  Then release the Hoist Up button.
6. Only one target is exposed at a time.  To look at another target.  Choose Select.  Choose Logo.  Choose Direct Control.  Choose RUN.  Choose the shutter you wish to view.  For example to view the target in station 3 choose SHUTTER3.
7. Visually inspect all the targets you plan to use.  Make sure that they are the proper material and that they are not melted or destroyed. If there is anything wrong with a target, please contact MiRC staff.
8. Vacuum any debris or particles from around or on the targets.
9. Make sure the tungsten filament over the desired target is not broken.
10. Load your samples into the chamber.  Small samples need to be pinned down using the wires provided.  Also samples should be no thicker than 3/8".
11. After your samples are loaded, turn ON the Rotostrate Control located near the bottom of the rack.  Set the speed (red knob) to 6.  Your samples should now be rotating.  Make sure that they stay pinned and do not move.

Caution: The hoist motor can apply several tons of force on the chamber lid. Be sure that no objects are under the lid and that everyone is clear of the lid before you lower it.

12. Press and hold the Hoist Down button above the monitor.  Release the button when the top chamber stops moving.

II. Operating the Sputterer

1. Press Esc.  If you are not back at the Pal System Option Page, press Esc until you are.
2. Now that your samples are loaded you need to setup the batch you are going to run.  A batch is set of one or more recipes that the machine will run together. There is separate recipe for each target. Choose Batch from the Pal System Option Page.  Choose Select.  Choose the name of the batch you wish to run.
3. The screen now displays a list of the recipes that the batch runs.  Write down the names of the recipes (steps) that the batch runs. Press Esc.
4. Esc back to the Pal System Option Page.
5. Choose Recipe.  Choose Different Recipe/Class.  Choose the recipe you want to edit.
6. The screen now displays the parameters of the recipe you chose.  To change one of the parameters.  Choose Edit Step.  Highlight the name of the parameter you wish to change using the cursor keys.  Press Enter.  Type in the new value and press Enter.  Press Esc to save.
7. When you have set the parameters you want, Esc back to the Pal System Option Page.
8. If you are using heat in your batch, turn on the Work Heater.
9. Choose Operate.  Go the Logo Page.  Go to Select.  Choose Direct Control.  Choose RUN.  Choose the name of your batch. The sputterer will perform the process now. Some stages of the process will take a while. The screen will display "****Chamber Vented Hoist Enabled***" when the process is complete.

 III. Unloading Sputterer

1. When your batch is done running, the screen will say "****Chamber Vented Hoist Enabled****".  Press and hold the Hoist Up button.  Once the top of the chamber is up, release the button and remove your samples.
2. Press and hold the Hoist Down button until the top of the chamber stops.
3. Go to the Logo page. Choose Direct Control.  Choose RUN.  Choose PUMPDOWN.
4. When the HI VAC valve opens and the ionization gauge at the top of the rack reads pressure, Esc back to the Pal System Option Page.
5. If there were any problems with this run, please note them in the log book and in the comments book in the gowning room.

Changing Targets

1. Press ESC until the main menu is displayed. Press "O" for Operate.
2. If the chamber is not open, check to see if "***CHAMBER VENTED HOIST ENABLED***" appears at the bottom of the screen. If this message does not appear, you will need to vent the chamber by doing the following:
   1. Using the arrow keys, choose SELECT, then choose LOGO.
   2. Choose DIRECT CONTROL, then select RUN and select VENT.
   3. Wait for the message "***CHAMBER VENTER HOIST ENABLED***" to appear at the bottom of the screen.
3. Make sure the the chamber vented message is displayed at the bottom of the screen, then press and hold the HOIST UP button over the monitor to raise the hoist. You need to get the hoist high enough that you can reach the target. You can adjust its height later using the HOIST UP and HOIST DOWN buttons, so do not worry about the exact height at this time.
4. Using the arrow keys, choose SELECT, then select LOGO and press enter.
5. Select DIRECT CONTROL and press enter.
6. Select RUN and press enter.
7. Select SHUTTERN, where N is the number of the station where you are changing the target and press enter.
8. There are two types of guns on the RF Sputterer. One of them has screws on it and you need a screw driver to screw it on and take it off. The targets on the second one can be changed by removing the clamp and the shield around it with your hands.
9. Instructions to change the target on the first type of gun( the one with actual screws on it).
10. Loosen and remove the outer ring, called the dark space sheild, from around the target by turning it counter-clockwise.
11. Remove the inner ring in the same manner.
12. Lift out the old target and put it in the appropriate plastic box in the drybox in the hallway hear the RF sputterer.
13. Get the new target out of this same drybox.
14. Place the new target into the sputter gun so that the flat side is facing down.
15. Secure the target in place by screwing the target retainer ring around it. The ring should fit snugly, but do not overtighten it.
16. Install the sheild around the target, leaving about one quarter of an inch of space between the sheild and the inner ring.
17. Using a multimeter, check to be sure that the target and shield are not electrically connected. The easiest way to do this is to use the meters diode check function. Put one probe on the target retainer ring and one on the shield. The meter should not beep. If the meter does beep, there is a problem. If this occurs, contact MiRC staff. Do not operate the sputterer if the target is electrically connected to the shield.
18. Lift the gun back up so that the line on the gun shaft is just over the stopper ring or so that the gun is at the same height as the other gun.
19. While holding the gun in place, tighten the Ultra-Torr fitting by hand. There is no need to use a wrench on this fitting.
20. While continuing to hold the gun, tighten the stopper ring onto the shaft immediately above the Ultra-Torr fitting.
21. Changing the target on the second type of gun( the one which has no screws on it).
22. Follow the first 9 instructions and then the ones below.
23. The shield has no screws. It is removed by turning counter-clockwise (when looking at the target). Hold the shaft of the gun while unscrewing the shield. This will prevent damage to the internal components of the gun.
24. Wipe any conductive thermal paste off of the back side of the target and off of the face of the sputter gun.
25. Put the target in the appropriate box and store it in the drybox near the rf sputterer.
26. Get the new target out of the box.
27. If you are using a metal, coat the back side of the new target with conductive thermal paste. Use only a very small amount of paste. You only need a very thin layer of paste on the target. Try to avoid getting paste on the front of the target.
28. Put the target in the recessed area of the gun. It should not be able to slide if it has been inserted correctly.
29. Thread the target clamp onto the gun carefully. It should screw on easily. Do not force the clamp. If it will not screw on easily, remove it and try again.
30. Hold the shaft of the gun (under the machine) while screwing on the target clamp. Tighten the clamp securely to ensure that the target makes good contact with the gun.
31. Look at the target from the side. The target should be flat against the gun. If it is not, you need to take it off and reinstall it.
32. To install the shield, screw it on the gun till the gap between the shield and the target is a quarter of an inch.
33. If you are using a metal then, using a multimeter, check to be sure that the target and shield are not electrically connected. The easiest way to do this is to use the meters diode check function. Put one probe on the target and one on the shield. The meter should not beep. If the meter does beep, there is a problem. If this occurs, contact MiRC staff. Do not operate the sputterer if the target is electrically connected to the shield.

What Happens When the Batch is Running

1. The roughing valve is opened and the mechanical pump pumps the chamber to 300 millitorr.
2. The roughing valve is closed and the high vacuum valve is opened. The ion gauge is turned on. The cryo-pump pumps the chamber to 5 x 10^-6 torr.
3. The throttle valve is closed, partially obstructing the path from the chamber to the cryo-pump. Argon is admitted to the chamber and the chamber pressure is raised to 6 millitorr.
4. For each material being deposited:
1. The shutter on the bottom of the chamber lid (under the sputtering guns) is moved to a station that is not currently being run.
2. One of the power supplies on the instrument rack applies power to the sputtering gun that is being run. The plasma igniter filament is turned on.
3. Once the plasma ignites, the igniter filament is turned off
4. The power supply gradually ramps the power to the setpoint set in the appropriate Recipe screen.
5. The shutter is turned to expose the running sputtering gun. The process timer begins counting down from the time set in the appropriate Recipe screen.
6. When the timer reaches zero, the power supply shuts off.
5. The argon is shut off. In most cases the high vacuum valve is closed at this point, the ion gauge is tuned off, and the chamber is vented to atmospheric pressure with nitrogen. In some cases, the throttle valve will open and the cryo-pump will remain pumping on the chamber after the run.

Other Notes:

• Always check the target before using it to ensure that it is the correct target. Do not assume that the sign on the front of the sputterer identifies the target correctly.
• Record you run and results in the log book.
• Always vacuum the inside of the chamber and the target surface to be sure that there are not loose particles present. Design of the sputterer tends to allow particles to fall onto the targets.

Troubleshooting

Nothing was deposited on my sample during the run.

The sputterer doesn't ever start sputtering.

The sputter displays the message "TIMER.1 LOW LIMIT EXCEEDED" when it is powering up the sputtering gun.