CEE Model 100CB Spinner/Hotplate

Trainers

Spin coaters are used to distribute photoresist in a thin uniform layer by spinning the substrate. The CEE 100CB spinners are reserved for photoresist use. Spin coatings of other materials must be done with the SCS spinners.

The CEE 100CB spinners are also equipped with hotplates designed for photoresist curing. These hotplates feature optional vacuum contact for improved thermal contact between the substrate and hotplate.

Features

6,000 RPM maximum spin speed with 5 RPM accuracy
0.5" - 8" substrates depending on chuck size
300°C maximum hotplate temperature

Operating Instructions

Warning: Photoresist releases toxic vapors. Therefore, the following safety measures must be taken by all spin coater users. Failure to observe these simple safety measures endangers the health of all cleanroom users and will not be tolerated.

Open photoresist bottles must be under a fume hood at all times.
Spin coater covers should be closed while spinning.
The hinged panel on the front of the fume hood must be closed while spinning.

To toggle between the Spinner and Hotplate at any time press OPTION. Once a program is complete, the system automatically switches to that controller. For example, if the spinner completes a run and you are currently in the hotplate mode, the system will switch to the spinner automatically.

Spinner

I. Programming

Select the Spinner mode by pressing OPTION Press: PROG
The display will read, "Prog Mode/Prog#?". Enter the Program # you want to edit (Ex.: 1).
The display will read, "Pg/1 Vel/0". The "1" refers to the program #; the "0" refers to the setpoint #. Enter the final RPM speed for setpoint #0. Press ENTER
The display will read, "Pg/1 RMP/0". Enter the ramp rate (RPM/s) you wish to ramp to final spin speed. Press ENTER.
The display will read, "Pg/1 Time/0". Enter the spin time for the set point #0. This time includes the ramp and final spin time. Press ENTER.
Continue to program setpoints 1,2,3 etc.

II. Running a program

Press: RUN
The display will read, "Prog#". Enter the Program #. Press ENTER.
The display will read, "Ready- Press Start". Load wafer on spin chuck. Press START
The wafer will spin to check centering. The wafer chuck will not spin if there is inadequate vacuum. Visually check and manually center.
The display will read, "0 to retest/Start". If further centering is necessary, adjust the wafer and press 0. If the wafer is properly centered, dispense spin solution and press START.
Once completed, the alarm will ring. The alarm will continue to ring until the wafer is removed from the spin chuck and the vacuum is released.
The spinner is ready for the next sample and the display will read, "Ready- Press Start"

Hotplate

I. Programming

Press: PROG
The display will read, "Prog Mode/Prog#?". Enter the Program # you want to edit (Ex.: 1).
The display will read, "Temp". Enter the temperature desired. Press ENTER. There are three modes of heating:
Proximity (PROX)- Heating occurs as a flow of air is used to raise the substrate above the hotplate Contact (CONT)- Heating is in direct contact with the hot surface Vacuum (VAC)- Heating is in direct contact under vacuum with the hot surface.
The display will read, "Method 1_ Time 1 M_S_". Select the mode of heating. Press ENTER. Select the time for Method 1. Press ENTER.
Continue to program Method 2, 3, etc.

II. Running a program

Press: RUN
The display will read, "Prog#". Enter the Program #. Press ENTER.
The display will read, "Setting Temperature".
Once the set point is acheived, the display will read, "Ready- Press Start". Load wafer on to hotplate. Press START.
Once the program is complete, a short alarm will sound. Remove the sample. The hotplate is immediately ready for the next sample.