Three baselines, hosted in a 7,000sq. ft. class 10-100 cleanroom and capable of 4"-6" wafer production, have been established at the Microelectronics Research Center:

• 20 um NMOS CHEMFET
• 2.5 um P-well, single metal, single poly
• 1.3 um N-well, double metal, double poly

The baselines include process simulation, circuit design, mask generation, a set of processing equipment and recipes, and a set of test and measurement instruments. The processing equipment includes horizontal diffusion furnaces, MA-6 mask aligner, sputterers, spin coaters, RCA clean station, rinse and dryer, pattern generator, stepper, ICP etcher, RIEs, PECVDs, evaporators, and a Hitachi S-3500H SEM.